Yamaha S10

Ultimate Flexibility to realize 3D MID* Placement
  • Enhancement to 3D MID
  • Large board handling capability
  • Wide ranging component handling capability and high feeder capacity
  • Ultimate flexibility and fast & easy setup
* 3D MID: Molded Interconnect Device



Board size(with buffer unused)Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955)
Board size(with input or output buffer used)Min. L50 x W30mm to Max. L420 x W510mm
Board size(with input and output buffers used)Min. L50 x W30mm to Max. L330 x W510mm
Board thickness0.4 – 4.8mm
Board flow directionLeft to right (Std)
Board transfer speedMax 900mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.0.08sec/CHIP (45,000CPH)
Placement accuracy A (μ+3σ)CHIP +/-0.040mm
Placement accuracy B (μ+3σ)IC +/-0.025mm
Placement angle+/-180 degrees
Z axis control / Theta axis controlAC servo motor
Component heightMax 30mm*1 (Pre-placed components: max 25mm)
Applicable components0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)
Component package8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray
Drawback checkVacuum check and vision check
Screen languageEnglish, Chinese, Korean, Japanese
Board positioningBoard grip unit, front reference, auto conveyor width adjustment
Component typesMax 90 types (8mm tape), 45 lanes x 2
Transfer height900 +/- 20mm
Machine dimensions, weightL1250xD1750xH1420mm, Approx. 1,200kg
*1 Board thickness + Component height = Max 30mm