MITSUBISHI CO2 Laser Processing System Series

MITSUBISHI Fiber Laser Cutting Machine

MITSUBISHI CO2 Laser Processing System Series

MITSUBISHI CO2 Laser Processing System Series

Description

（1）激光光学系统

使光束模式可整形为适于厚板切割的模式

=> 提高厚板加工能力

（2）新型喷嘴

适于对光纤激光波长领域的辅助气体（氧化反应）的控制

=>提高断面质量，节省加工气体

（3）HPP（高峰穿孔）

=>提高穿孔速度，大大改善中厚板・厚板生产能力

薄板厚板加工无需更换加工透镜，自动调整最适化模型切割

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